Pastilles Autocollantes pour le maintien des fils. Pastilles permettant le maintien des fils en position en cas de réparation "en volant"
Flextac Tape Dots -
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Introducing New and Improved Flextac Tape Dots
Our original Tape Dots #115-1352 have been replaced by a new and improved version #310-2100. These new Flextac Tape Dots come in sheet form and are available in 4 different sizes. A larger selection of sizes, but the same great "stick".
Description
Flextac Tape Dots are a wire tacking system consisting of pre-cut shapes of a thin, flexible polymer film membrane coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive resulting in a highly conformable, high strength bond. The adhesive release liner is an environmentally stable poly-coated kraft liner.
As with any wire tacking material, in order to achieve maximum bond strength and reliability, application surface must be clean, dry and free of flux, skin oils and other contaminants. Clean with isopropyl alcohol or equivalent if necessary. Firm application pressure develops better adhesive contact and thus improves bond strength. Avoid placing Flextac Tape Dots or any other wire tacking material directly over exposed copper or plated surfaces.
Flextac Tape Dots will perform best when applied at temperatures between 60°F (15°C) and 100°F (38°C). Do not apply below 50°F (10°C).
General Performance Characteristics
- Bond Strength
Flextac Tape Dots have very good initial bond strength that generally increases as a function of time over approximately 72 hours to stabilize as a high strength reliable bond. - Humidity Resistance
High humidity has a minimal effect on adhesive performance. Bond strengths are actually slightly higher after exposure for 7 days at 90°F (32°C) and 90% relative humidity. - Temperature Cycling and Bond Strength
Bond strength generally increases after four times through:
4 hours at 158°F (70°C)
4 hours at -20°F (-29°C)
16 hours at room temperature. - Cleaning Process Resistance (chemical & hot water)
Tape Dots will hold securely after exposure to numerous chemicals including most flux cleaning solutions/sprays, saponifiers, "Freon" TF, mild acids and alkalis. Wires will hold securely through a typical PCB hot water wash. - Temperature Range
Low: -40°F (-40°C)
High short term: 390°F (200°C)
High long term: 275°F (135°C) - Repositioning
Flextac Tape dots can be repositioned during and immediately after initial bonding without causing adhesive transfer or loss of bond strength. - Shelf Life
Product retains its performance and properties for one year from date of purchase if properly stored at room temperature conditions. Storage in plastic bag is recommended.
| Physical and Thermal Properties | |||
| Property | Typical Value | Unit | Test Method |
| Peel Strength 72 hrs @ 22°C | 84 | 0z./in. | ASTM D3330 Modified |
| Static Shear Strength 72°F (22°C) / 1000g | >10,000 | min | ASTM D3654 |
| Tensile Strength (Yield) 72°F (22°C) | >2600 | psi | ASTM D2370 |
| Elongation | 100 | % | ASTM D2370 |
| Thermal Conductivity | 0.17 | w/m-k | ASTM C518 |
| Coefficient of Thermal Expansion | 5.5 x 10 -4 | m/m/C | ASTM D696 25-175C |
| Electrical Properties | |||
| Property | Typical Value | Unit | Test Method |
| Dielectric Strength | 1700 | volts/mil | ASTM D149 |
| Dielectric Constant 25°C, 1 kHz | 3.4 | ------ | ASTM D150 |
| Dissipation Factor 25°C, 1 kHz | 0.018 | ------ | ASTM D150 |
| Surface Resistivity - Adhesive Layer | >1 x 10 14 | ohm/square | ASTM D257 |
| Surface Resistivity - Polymer Film Layer | >1 x 10 16 | ohm/square | ASTM D257 |
| Volume Resistivity - Adhesive Layer | >1 x 10 15 | ohm/cm | ASTM D257 |
| Volume Resistivity - Polymer Film Layer | >1 x 10 18 | ohm/cm | ASTM D257 |
| Insulation/Moisture Resistance - Adhesive Layer | >1 x 10 11 | ohm | MIL-I-46058C (100 VDC 60 sec) |
| Insulation/Moisture Resistance - Polymer Film Layer | >1 x 10 12 | ohm | MIL-I-46058C (100 VDC 60 sec) |
| Voltage Breakdown | 3500 | volts | ------ |
Applications
- Bonding jumper wires used for modifications.
IPC 7721 Repair Procedure - 6.1 Jumper Wires - Bonding jumper wires used for conductors repairs.
IPC 7721 Repair Procedure - 4.2.4 Conductor Repair, Surface Wire Method







