Le kit de réparation CTC est le plus complet et le plus polyvalent que vous ne puissiez trouver. Il contient tous les outils et accessoires nécessaires à la réparation de circuits imprimés endommagés.
Applications
Réparation des coins cassés, application de solder mask, remplacement des pistes et des pastilles pour CMS et BGA ,réparation des trous métallisés, remplacement des contacts dorés.
La mallette comprend tous les accessoires de qualité, est très économique, et vous permet de sauver des circuits jusqu'ici condamnés.
201-2102 Professional Repair Kit 230V
Damaged Base Material
Damaged Base Material
Figure 1: Scrape away damaged base board material with a knife.
Figure 2: Micro-Drill System. 
Figure 3: An undercut, to enhance mechanical strength, may be desired for class 3 product.
Figure 4: Apply the epoxy with a mixing stick sharpened at the end. 
Figure 5: For large areas, apply the epoxy with a foam swab to create a texture.
Damaged Base Material
Damaged Base Material
Figure 1: Cut away damaged base material with the Saw or milling cutter.
Figure 2: Cut a groove into the edge of the circuit board.
Figure 3: Mill a tongue onto the edge of the replacement base material.
Figure 4: Check fit of new base material. The tongue must mate with the groove in circuit board.
Figure 5: Micro-Drill System.
Damaged Plated Hole
Damaged Plated Hole
Figure 1: Drill out the hole using a Micro-Drill System and ball mill.
Figure 2: The eyelet flange can be used to secure a new circuit in place.
Figure 3: Set the eyelet using an Eyelet Press.
Figure 4: Completed repair.
Damaged Surface Mount Pad
Damaged Surface Mount Pad
Figure 1: Remove the defective pad and remove soldermask from the connecting circuit
Figure 2: Select a replacement pad that matches the missing pad.
Figure 3: Scrape off the adhesive bonding film from the solder joint area on the back of new pad.
Figure 4: Cut out the new surface mount pad. Cut from the plated side.
Figure 5: Place the new surface mount pad in place using Kapton tape
Figure 6: Bond the new pad using a Bonding System.
Figure 7: Completed repair.
Delamination
Delamination
Figure 1: Drill into the delamination blister using a ball mill and a Micro-Drill.
Figure 2: Inject epoxy into the delamination blister.
Figure 3: Completed repair.
Figure 4: Micro-Drill System.
Damaged Key Slot
Damaged Key Slot
Figure 1: Mill away the damaged board base material using a Micro-Drill System and ball mill.
Figure 2: Apply epoxy to the edges of the key slot using a mixing stick sharpened at the end.
Figure 3: Completed key slot repair.
Figure 4: Micro-Drill System.
Contenu du Kit:
|
Part No. |
Qty |
Description |
|
115-6002 |
1 |
Ball Mill, Carbide, #2, .039" Diameter |
|
115-6003 |
1 |
Ball Mill, Carbide, #3, .047" Diameter |
|
115-6004 |
1 |
Ball Mill, Carbide, #4, .055" Diameter |
|
115-6005 |
1 |
Ball Mill, Carbide, #5, .063" Diameter |
|
115-6006 |
1 |
Ball Mill, Carbide, #6, .071" Diameter |
|
115-6007 |
1 |
Ball Mill, Carbide, #7, .083" Diameter |
|
115-6050 |
1 |
Ball Mill, Carbide, #1/2, .027" Diameter |
|
115-3962 |
2 |
Base Board Transplant, FR4, .062" Thk. |
|
115-3993 |
2 |
Base Board Transplant, FR4, .093" Thk. |
|
115-2706 |
1 |
Bonding Film, 1.50" x 2.25" |
|
115-3102 |
1 |
Bonding Iron, 120 VAC |
|
115-2104 |
1 |
Bonding Tip, Tapered |
|
115-2202 |
1 |
Bonding Tip, .060" Diameter |
|
115-2205 |
1 |
Bonding Tip, .035" Diameter |
|
115-2210 |
1 |
Bonding Tip, .120" Diameter |
|
115-2304 |
1 |
Bonding Tip, .025" x .080" |
|
115-2306 |
1 |
Bonding Tip, .040" x .060" |
|
115-2318 |
1 |
Bonding Tip, .080" x .500" |
|
1 |
Circuit Frame, BGA Pads .025"/.035" |
|
|
1 |
Circuit Frame, Contacts .050"/.060" |
|
|
1 |
Circuit Frame, Contacts .070"/.080" |
|
|
1 |
Circuit Frame, PTH Pads .050"/.060" |
|
|
1 |
Circuit Frame, PTH Pads .070"/.080" |
|
|
1 |
Circuit Frame, PTH Pads .090"/.100" |
|
|
1 |
Circuit Frame, SMP Variety |
|
|
1 |
Circuit Frame, Variety |
|
|
1 |
Circuit Track, .002" x .006" |
|
|
1 |
Circuit Track, .002" x .010" |
|
|
1 |
Circuit Track, .003" x .015" |
|
|
1 |
Circuit Track, .005" x .030" |
|
|
1 |
Color Agent, PMS 348 |
|
|
1 |
Color Agent, PMS 358 |
|
|
4 |
Epoxy |
|
|
115-3310 |
1 |
Eraser |
|
50 |
Eyelet, Flat Flange .030" ID x .093" LUF |
|
|
50 |
Eyelet, Flat Flange .033" ID x .093" LUF |
|
|
50 |
Eyelet, Flat Flange .036" ID x .092" LUF |
|
|
50 |
Eyelet, Flat Flange .045" ID x .093" LUF |
|
|
115-3132 |
1 |
File |
|
235-2102 |
4 |
Foam Swab |
|
355-2102 |
1 |
Knife |
|
115-3138 |
1 |
Mill Handle |
|
115-3314 |
4 |
Mixing Stick |
|
115-3312 |
4 |
Plastic Cup |
|
115-3360 |
4 |
Plastic Probe |
|
115-3108 |
1 |
Circuit Board |
|
115-3362 |
1 |
Rod, FR4, .093" Diameter |
|
115-3364 |
1 |
Rod, FR4, .125" Diameter |
|
115-3366 |
1 |
Rod, FR4, .187" Diameter |
|
355-4235 |
1 |
Saw Blade |
|
115-3120 |
2 |
Setting Tool |
|
115-3902 |
3 |
Syringe Assembly |
|
115-3122 |
1 |
Tool Base |
|
115-3134 |
1 |
Tool Handle |
|
1 |
Tape Dots, Variety Pack |
|
|
950-4508 |
1 |
Tape, Kapton |
|
115-3142 |
1 |
Tip Tool |
|
335-5183 |
1 |
Tweezer |
|
115-3103 |
1 |
* Bonding Iron, 230 VAC (201-2102 Kit) |
