JewelBox-70T

Real-time X-ray Inspection System

The JewelBox-70T delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. The system's high-resolution x-ray camera and 10-micron MicroTech^TM x-ray source provide magnification from 7X to 2000X, with resolution of 100 line pairs/mm.

Glenbrook's unique x-ray camera technology captures x-ray images with relatively low kV x-ray emission. This permits the JewelBox-70T to be built with a transparent enclosure on all four sides. The ability to manipulate the subject with the five-axis positioner and simultaneously view it from any angle allows the operator to produce accurate images quickly during failure analysis.

JewelBox-70T

All JewelBox inspection systems come with the pre-installed GTI-5000 Image Processing Workstation. The extensive features of the GTI-5000, including Auto-BGA and void measurement, make the JewelBox-70T an ideal laboratory instrument to inspect electronic components. For customers who don't need the advanced capabilities of the GTI-5000, the economical GTI-1000 is available as an option.

Specifications:

• Operating voltage: 120v/220v/50-60 hz
• Anode voltage: 80 kV (adjustable)
• Anode current: 100 microamps (adjustable)
• Magnification: variable from 7X to 2000X
• Focal spot size: 10 micron
• Focal spot to image plane distance: 13 7/16" (341.3mm) (factory preset)
• Nominal exterior dimensions: 35 1/8"W x 43 1/8"D x 64 1/4"H (892.175mm L x 1095.375mm W x 1631.95mm H)
• Inspection compartment dimensions: 28 1/2"W x 30" D x 23 3/4"H (723.9mm L x 1095.375mm W x 1631.95mm H)
• Manipulator: five-axis joystick positioner
• Image Processing: GTI-5000 image processing workstation pre-loaded on PC computer with monitor, keyboard and mouse
• Computer console

All JewelBox systems are supplied with PC computer, monitor, keyboard, mouse and computer console (not shown).

JewelBox-90T

Real-time X-ray Inspection System

The JewelBox-90T delivers precision x-ray images of ultra-high resolution and grey scale accuracy without the aberrations of voltage blooming and pincushioning prevalent in other systems.

Glenbrook's patented, award-winning X-ray camera technology, in conjunction with its 5-micron x-ray source, delivers precise x-ray images at magnifications from 7X to 2000X with a resolution of 100 line pairs/mm. The broad energy sensitivity range of the x-ray camera permits x-ray imaging of both high-density and low-density devices.

The JewelBox-90T offers five-axis control over the inspected product, including 360° rotation and tilt. The 90T is approximately half the size and half the price of systems with comparable performance.

JewelBox-90T

The JewelBox-90T uses a powerful 90kV micro-focus x-ray tube for deep penetration of dense materials, including metal BGAs. The JewelBox-90T uses Glenbrook's X-ray camera, the most sensitive in the world. The camera's sensitivity allows imaging of low-density materials such as plastics, polymers, collagen and urethanes, as well as very small parts fabricated from ceramics and titanium.

All JewelBox inspection systems come with the pre-installed GTI-5000 Image Processing Workstation. The extensive features of the GTI-5000, including Auto-BGA and void measurement, make the JewelBox-90T an ideal laboratory instrument to inspect electronic components. For customers who don't need the advanced capabilities of the GTI-5000, the economical GTI-1000 is available as an option.

Specifications:

• Operating voltage: 120v/220v/50-60 hz (self-switching)
• Anode voltage: 100 kV (adjustable)
• Magnification: variable from 7X to 2000X
• Focal spot size: 5 micron
• Focal spot to image plane distance: 9-12" (228.6mm - 304.8mm) (factory preset)
• Outside dimensions: 35 1/8"W x 43 1/8"D x 74"H (892.175mm L x 1095.375mm W x 1879.6mm H)
• Inspection compartment dimensions: 30"W x 31"D x 26"H (762mm W x 787.4mm L x 660.4mm H) (customizable up to 36" x 36" (914.4mm x 914.4mm) on request)
• Manipulator: five-axis joystick positioner
• Image Processing: GTI-5000 image processing workstation pre-loaded on PC with monitor, keyboard, mouse.

 

JewelBox X-Ray Images

High-Resolution Inspection for Electronics Fabrication Applications

Progressive magnification allows inspection of multiple details:

24X view of an IC	The same IC at 65X
At 250X, ball bonds may be inspected	Also at 250X, wedge bonds are revealed

Image of a surface mounted IC permits inspection of the wires within the IC and the solder joint quality of the leads, revealing insufficient solder on the right-most lead.
Image of a micro BGA, rotated, reveals wire sweeps and solder ball shape.
Solder joints on a flip chip: note the large number of voids in each joint and bridging at the left side.
Dimensional view of solder balls pinpoints the precise location of solder voids within the balls.
Die attach, showing voids in the epoxy connecting the silicon to the metal lead frame.